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PU Adhesive For XPS Board

PU Adhesive For XPS Board

Detail:


 
Introduction:
It is 
a single-component glue that developed by our corporation, is superior in performance and operation. By adopting solidifying way of micro moisture in air and cohered surface, the glue line is no-dissolving and no-melting. Therefore it has been extensively used in metal plates such as color steel plates, galvanized plates and aluminium plates as well as inorganic boards such as paper gypsum planks, calcium silicate boards, glass magnesium boards, medium density board and ternary plates.  In addition, it can also applied to fireproof material rockwool, glass fiber, perlite, aluminosilicate fiber felt, heat insulating material EPS FWB foams,XPS, rigid PU foams, sound-proof materialpaper honeycomb, aluminum honeycomb and finishing materialmelamine board
.

Application Scope:
The xps board has the characteristics of high thermal resistance, low linearity and low expansion ratio. The closed cell rate of its structure has reached more than 99%, forming a vacuum layer to avoid air flow and heat dissipation, ensuring the durability and stability of its thermal insulation performance. Compared with foamed polyurethane With an 80% closed cell rate, the leading edge is self-evident.

Contact:

               Lucy
E-mail:  sales@puglue.com
              2900326926@qq.com
              info@puglue.com
Tel:        13616167336



 

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Email: sales@puglue.com    2900326926@qq.com    info@puglue.com
TEL:0086-13616167336
 


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